AMD Ryzen 7 5700X3D 8 Cores 16 Threads 105 W TDP 3 GHz Frequency 4.1 GHz Boost Vermeer Codename Socket AM4

AMD Ryzen 7 5700X3D 8 Cores 16 Threads 105 W TDP 3 GHz Frequency 4.1 GHz Boost Vermeer Codename Socket AM4

Original price was: $299.00.Current price is: $249.00.

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Features & Compatibility

The AMD Ryzen 7 5700X3D is a desktop processor with 8 cores, launched in January 2024, at an MSRP of $249. It is part of the Ryzen 7 lineup, using the Zen 3 (Vermeer) architecture with Socket AM4. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 16 threads. Ryzen 7 5700X3D has 96 MB of L3 cache and operates at 3 GHz by default, but can boost up to 4.1 GHz, depending on the workload. AMD is building the Ryzen 7 5700X3D on a 7 nm production process using 8,850 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on Ryzen 7 5700X3D, which limits its overclocking capabilities.
With a TDP of 105 W, the Ryzen 7 5700X3D consumes a good deal of power, so decent cooling is needed. AMD’s processor supports DDR4 memory with a dual-channel interface. The highest officially supported memory speed is 3200 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the machine, Ryzen 7 5700X3D uses a PCI-Express Gen 4 connection. This processor does not have integrated graphics, you will need a separate graphics card.
Hardware virtualization is available on the Ryzen 7 5700X3D, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD is including the newer AVX2 standard, too, but not AVX-512.

Physical

Socket: AMD Socket AM4
Foundry: TSMC
Process Size: 7 nm
Transistors: 8,850 million
Die Size: 74 mm²
I/O Process Size: 12 nm
I/O Die Size: 125 mm²
Package: µOPGA-1331
tJMax: 90°C

Processor

Market: Desktop
Production Status: Active
Release Date: Jan 8th, 2024
Retail Availability: Jan 31st, 2024
Launch Price: $249
Part#: 100-000001503
100-100001503WOF
Bundled Cooler: None

Performance

Frequency: 3 GHz
Turbo Clock: up to 4.1 GHz
Base Clock: 100 MHz
Multiplier: 30.0x
Multiplier Unlocked: No
TDP: 105 W
PPT: 142 W

Architecture

Codename: Vermeer
Generation: Ryzen 7
(Zen 3 (Vermeer))
Memory Support: DDR4
Rated Speed: 3200 MT/s
Memory Bus: Dual-channel
ECC Memory: Yes
PCI-Express: Gen 4, 20 Lanes
(CPU only)
Chipsets: AMD 300 Series*, AMD 400 Series, AMD 500 Series

Core Config

# of Cores: 8
# of Threads: 16
SMP # CPUs: 1
Integrated Graphics: N/A

Cache

Cache L1: 64 KB (per core)
Cache L2: 512 KB (per core)
Cache L3: 96 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • BMI1
  • BMI2
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • SMT
  • Precision Boost 2
  • XFR 2
  • 3D V-Cache

Notes

Level 3 cache arranged as 32MB 2D cache plus 64MB 3D V-Cache.

*AMD 300 Series chipset support is contingent on vendor updates to AGESA 1.2.0.6b/c.

Core overclocking disabled, DRAM/IF frequency tuning remains enabled.

ECC modes require motherboard support.

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